Innovative Design-Process Co-optimized Solutions
for Low Power and Smaller Area

Visit Tela Innovations at DAC for details of our collaborative programs with TSMC aimed at lowering power and reducing die sizes.

PowerTrim
Reduce leakage of logic blocks by up to 50% while maintaining the area and timing of your design

AreaTrim
Reduce the area of logic blocks by 20% using co-optimized standard cell libraries compatible with your existing design flow

See us at the Open Innovation Platform Booth
Sponsored by TSMC

Booth: 294

Presentation:
Reducing Power and Area with PowerTrim and AreaTrim

Monday, June 14 - 4:00p-4:15 PM
Tuesday, June 15 – 12:00-12:15 PM
Wednesday , June 16 – 3:00-3:15 AM

OIP Partner Passport Enter into the Open Innovation Platform (OIP) passport program to receive a special exhibitor gift bag from TSMC!

See Tela Innovations at the TSMC Open Innovation Platform™ partner booth #822. Learn more about how our interfaces and collaborations with TSMC create greater accuracy and quality in your designs.

learn more >>

Visit Tela Innovations at Booth #294

WHEN:
June 14 -16, 9:00am to 5:00pm

WHERE:
Booth #294
Anaheim Convention Center,
Anaheim, CA

Request a Private Meeting:

To request a private meeting, please send an email with 3 suggested dates and times for a meeting and approximate number of guests. We will respond to you within 48 hours of your request.

sales@tela-inc.com