For process manufacturers and chip designers: smaller die area and reduced device variability, resulting in lower leakage and improved performance. Early results have demonstrated are savings of up to 15% and a 2.5x improvement in leakage. The Tela approach also increases design productivity by hiding the physics of advanced manufacturing while preserving design intent.

For process development and manufacturers: a methodology to accelerate time to technology access and enable future technologies associated with double patterning.

For equipment manufacturers: the ability to enable a design approach that unlocks the full potential of their equipment and enable a roadmap for efficient use of double exposure and double patterning techniques.