TELA ADDS EXPERIENCED LICENSING EXECUTIVE TO MANAGEMENT TEAM

KEN DYER joins as VP of Licensing to strengthen Tela’s patent licensing program

Ken Dyer

LOS GATOS, Calif. – January 13, 2014 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, today announced the addition of Ken Dyer as Vice President of Licensing. In this role he will be responsible for overseeing all matters relating to the licensing of Tela’s extensive patent portfolio, including negotiating and executing patent license agreements.

“Tela’s focus since its founding in 2005 has been to develop fundamental technology related to the design of semiconductors in advanced technology nodes. To date Tela has more than 120 patents issued and a broad pipeline of additional innovations,” said Scott Becker, president and CEO of Tela. “Ken brings a unique combination of experience and credentials along with a successful track record in monetizing patent portfolios for innovations in semiconductor technology to the Tela team.”

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39th Annual GOMAC Tech Conference – March 31- April 3, 2014 – Charleston, SC

39th Annual GOMAC Tech Conference
March 31 – April 3, 2014
Embassy Suites North Charleston, South Carolina

GOMACTech is a conference established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

The GOMACTech conference is an Unclassified, Export-Controlled event that requires participants to be U.S. Citizens or legal U.S. Permanent Residents. All registrants must provide proof of U.S. Citizenship or Permanent Resident status prior to being permitted entry into the conference. Additionally, a signed Non-Disclosure Statement will be required.

Learn more here: www.gomactech.net

USITC INSTITUTES SECTION 337 INVESTIGATION BASED ON TELA INNOVATIONS COMPLAINT

TELA INNOVATIONS, INC. FILES COMPLAINT AT THE U.S. INTERNATIONAL TRADE COMMISSION FOR UNFAIR TRADE PRACTICES STEMMING FROM PATENT INFRINGEMENT

LOS GATOS, Calif. – February 11, 2013 – Tela Innovations, Inc. today announced that it filed a complaint with the U.S. International Trade Commission (USITC) against HTC Corporation, HTC America, Inc., LG Electronics, Inc., LG Electronics U.S.A., Inc., LG Electronics MobileComm U.S.A., Inc., Motorola Mobility LLC, Nokia Corporation; Nokia, Inc.; Pantech Co., Ltd.; and Pantech Wireless, Inc. (collectively, the “Respondents”) alleging that the Respondents have engaged in unfair trade practices by selling for importation into the United States, importing into the United States, and/or selling after importation into the United States certain consumer electronics devices that infringe seven of Tela’s United States patents.
Tela has created patented design solutions for advanced IC manufacturing processes where lithography-driven constraints require novel approaches to both digital circuit design and the physical implementation of these designs. These solutions are utilized in the most recent generation of products offered by the named Respondents.

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TELA RANKS AMONG INDUSTRY HEAVYWEIGHTS IN IEEE SPECTRUM REPORT ON ‘PATENT POWER’

Unique solutions that help IC manufacturing scale place Tela in Top 20 of prestigious list of important and quality innovation portfolios

LOS GATOS, Calif. – January 9, 2012 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, has been ranked by IEEE Spectrum magazine as being among the leaders of the semiconductor and electronics industry for the quality and potential impact of its patents. In the 2012 edition of its prestigious Patent Power list, the publication ranks Tela 11th in the Semiconductor Manufacturing category, placing the company alongside major suppliers such as Samsung (#1), SanDisk (#2), Broadcom (#4), Intel (#12) and Rambus (#13).

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