by Peter Clarke
Processors, memory, manufacturing processes, chip architecture, EDA, MEMS, RF, touch screens, servers and the Internet of Things are markets where startups can still make a difference.
What follows are ten rising companies worth tracking in 2013.
Tela Innovations Inc. (Los Gatos, Calif.) was founded in 2005 and started by working with Qualcomm on computational lithography with a view to the extraction of multi mask information for the double patterning era.
Tela’s technology is delivered as physical design representation applied to standard cell logic and embedded SRAM, analog and I/O that can result in area savings and reduced leakage current. The company offers gate-length trade-offs for power, performance and area within its libraries. Tela has also specialized in working with customers’ IP development teams to get the technology into production.Read More»
Tela Innovations has released its new standard cell libraries optimized for 32/28nm and 22/20nm manufacturing processes. The foundry-independent libraries leverage the company’s proactive approach to the design challenges posed by lithography constraints at 28nm and below, stated the company.
The Tela approach embraces the inherent lithography constraints and results in designs with simpler, more manufacturable shapes. From a designer’s perspective, Tela’s approach to layout is transparent, as the libraries contain a complete set of functions that provide the ability to implement optimized designs based on all of their specific performance, power and area (PPA) requirements. In addition, the Tela libraries go further and introduce cell options for routability tradeoffs providing additional design flexibility, the company revealed.Read More»
EE Times, Mark LaPedus
SAN JOSE, Calif. – At the SPIE Advanced Lithography conference here, maskless startup Multibeam Corp. will outline more details about its ongoing efforts to commercialize its so-called Complementary E-Beam Lithography (CEBL) technology in the market.
Multibeam (Santa Clara, Calif.) will describe the latest developments of its CEBL tool, a multi-column, maskless lithography system designed for patterning the most critical layers in a design–contact holes, vias and line cutting–at the 16-nm node and beyond. Throughput is said to be five wafers an hour–more than twice the speed of today’s single-beam e-beam tools.Read More»
Semiconductor Manufacturing and Design
By Marc D. Levenson
Does the transition to 450mm wafers offer the ultimate opportunity to switch to maskless lithography (ML2)? That was the suggestion made by Burn Lin, senior director of micropatterning at TSMC in his keynote for the SPIE Alternative Lithography Conference in San Jose Feb. 14. The 450mm transition would appear to require expensive development of a variety of patterning tools and resists if a conventional mix-and-match strategy were employed. Since multi-electron beam lithography can be used to write any layer, one 450mm e-beam direct-write tool could pattern them all, and for 30% lower cost at any production volume. Only one machine would have to be engineered and only a few resists formulated.Read More»
The eBeam Initiative held its annual Luminaries Dinner at the Plumed Horse Restaurant in Saratoga, CA. This exclusive event gathers the industry’s top minds after a day at the 2012 SPIE Advanced Lithography Conference.
by Daniel Payne in Cell Libraries, DAC 2009
Neal Carney met with me on Monday afternoon to provide an update on what’s new at this hard IP company. They acquired Blaze DFM in the last year and are offering two products: PowerTrim and AreaTrim.TSMC is their exclusive partner using these new 1D layout cells that provide improved performance and yield at 65nm nodes and smaller.With PowerTrim the idea is to look at your design after placement and routing, find all the paths that still have margin and then selectively upsize the channel lengths to reduce power consumption while maintaining timing specs. Users benefit as these updated cells have reduced leakage because of the CD biasing. In one example I saw a 42% reduction in leakage current while only increasing the path delay by 7%.Read More»
VentureBeat, Chris Morrison
Tela Innovations is a Campbell, Calif. company with a technology for manufacturing 45 nanometer chips, which have just coming to the consumer market starting with Intel’s Penryn processor. The company uses computational lithography techniques to address a special problem encountered in the manufacture of extremely advanced chips, when the wavelength of light used in manufacturing begins to become larger than the chips themselves.Read More»
EDN, Paul McLellan
The mystery of whether Blaze DFM had closed down or not is over. It has been acquired by Tela Innovations mainly, it would seem, for the PowerTrim technology that had been licensed by TSMC. A major strategic relationship between Tela and TSMC was also announced. Both these are interesting developments.Read More»
END, Ron Wilson
The SPIE Advanced Lithography conference, officially a very technical event tightly focused on photolithography, has become one of the annual watering holes for the semiconductor process front-end-of-line community—a who’s who of lithography, handling and plumbing equipment, materials, consumables, and other such experts. As such, it is usually big and bustling. But this year, it gives the distinct impression of an industry knocked unconscious.Read More»
by James Montgomery, News Editor, Solid State Technology
In a move that combines two DFM startups, Tela Innovations has acquired Blaze DFM. Terms of the deal weren’t announced, but a Tela spokesperson confirmed only one Blaze management exec is being kept — Rajiv Bhateja, VP of operations, is now Tela’s VP of power optimization products. In a PR statement Tela added that “key engineering personnel” from Blaze will be kept on for “continuity of product development” and customer support. Blaze’s technology has already been renamed as Tela “power optimization software,” though the spokesperson said no decision has been made about specific product naming.Read More»