TELA RESOLVES PATENT DISPUTE WITH GOOGLE AND PANTECH

Agreements bolster Tela’s patent licensing program
LOS GATOS, Calif. – June 12, 2014 – Tela Innovations, Inc. announced that it has resolved its pending patent infringement litigation with Google by a mutual license agreement between the two companies. Tela also reached a separate agreement to settle its pending litigation with Pantech of Korea. Terms of the agreements will remain confidential.

Motorola Mobility LLC, acquired by Google in 2012, and Pantech were named as respondents in an investigation instituted in March 2013 by the United States International Trade Commission as a result of a complaint filed by Tela. Both parties were also named as defendants in Tela’s contemporaneously filed patent infringement action in the U.S. District Court for the District of Delaware. Joint motions to dismiss all pending litigation have been filed by the parties. Litigation against the remaining defendants in these suits, LG Electronics, Nokia and HTC, remains pending.
“Tela has invested significant resources to develop and protect its foundational technology enabling continued semiconductor scaling and these agreements are confirmation of the strength of our patent portfolio,” said Scott Becker, president and CEO of Tela. “Our patented products enable designers to achieve the best performance, area and power characteristics possible as semiconductor processes continue to scale.”

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TELA ADDS EXPERIENCED LICENSING EXECUTIVE TO MANAGEMENT TEAM

KEN DYER joins as VP of Licensing to strengthen Tela’s patent licensing program

Ken Dyer

LOS GATOS, Calif. – January 13, 2014 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, today announced the addition of Ken Dyer as Vice President of Licensing. In this role he will be responsible for overseeing all matters relating to the licensing of Tela’s extensive patent portfolio, including negotiating and executing patent license agreements.

“Tela’s focus since its founding in 2005 has been to develop fundamental technology related to the design of semiconductors in advanced technology nodes. To date Tela has more than 120 patents issued and a broad pipeline of additional innovations,” said Scott Becker, president and CEO of Tela. “Ken brings a unique combination of experience and credentials along with a successful track record in monetizing patent portfolios for innovations in semiconductor technology to the Tela team.”

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USITC INSTITUTES SECTION 337 INVESTIGATION BASED ON TELA INNOVATIONS COMPLAINT

TELA INNOVATIONS, INC. FILES COMPLAINT AT THE U.S. INTERNATIONAL TRADE COMMISSION FOR UNFAIR TRADE PRACTICES STEMMING FROM PATENT INFRINGEMENT

LOS GATOS, Calif. – February 11, 2013 – Tela Innovations, Inc. today announced that it filed a complaint with the U.S. International Trade Commission (USITC) against HTC Corporation, HTC America, Inc., LG Electronics, Inc., LG Electronics U.S.A., Inc., LG Electronics MobileComm U.S.A., Inc., Motorola Mobility LLC, Nokia Corporation; Nokia, Inc.; Pantech Co., Ltd.; and Pantech Wireless, Inc. (collectively, the “Respondents”) alleging that the Respondents have engaged in unfair trade practices by selling for importation into the United States, importing into the United States, and/or selling after importation into the United States certain consumer electronics devices that infringe seven of Tela’s United States patents.
Tela has created patented design solutions for advanced IC manufacturing processes where lithography-driven constraints require novel approaches to both digital circuit design and the physical implementation of these designs. These solutions are utilized in the most recent generation of products offered by the named Respondents.

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TELA RANKS AMONG INDUSTRY HEAVYWEIGHTS IN IEEE SPECTRUM REPORT ON ‘PATENT POWER’

Unique solutions that help IC manufacturing scale place Tela in Top 20 of prestigious list of important and quality innovation portfolios

LOS GATOS, Calif. – January 9, 2012 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, has been ranked by IEEE Spectrum magazine as being among the leaders of the semiconductor and electronics industry for the quality and potential impact of its patents. In the 2012 edition of its prestigious Patent Power list, the publication ranks Tela 11th in the Semiconductor Manufacturing category, placing the company alongside major suppliers such as Samsung (#1), SanDisk (#2), Broadcom (#4), Intel (#12) and Rambus (#13).

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TELA INTRODUCES NEW LITHOGRAPHY-OPTIMIZED STANDARD CELL LIBRARIES FOR 32/28NM AND 22/20NM PROCESSES

Physical IP blocks offer significant improvements in performance, power, and area by leveraging Tela’s approach to overcoming lithography-driven constraints

LOS GATOS, Calif. –JUNE 4, 2012 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, today announced the availability of new standard cell libraries optimized for manufacturing processes of 32/28nm and 22/20nm. The foundry-independent libraries leverage Tela’s unique proactive approach to the design challenges posed by lithography constraints at 28nm and below.

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TELA OFFERS FREE LEAKAGE ESTIMATE ON NEW WEB SITE

Quick turnaround analysis of logic designs using power optimization technologies that have demonstrated up to 78% leakage power reduction

LOS GATOS, Calif. – June 4, 2012 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, today announced the availability of a free, customized leakage analysis service for the logic portion of advanced System on Chip (SoC), ASIC designs. Reducing power to extend battery life and reduce heat dissipation is key to adding value in the highly competitive semiconductor market. The company uses a combination of its Tela Optimizer power reduction tool and its unique gate length biasing techniques to achieve up to 78% reduction in leakage on designs that have already been optimized using industry standard EDA tools and in-house optimization scripts.

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TELA NAMES INTELLECTUAL PROPERTY LAWYER AS GENERAL COUNSEL

Liz Stewart joins executive team as company evolves its IP and licensing strategies

Liz Stewart

LOS GATOS, Calif. – June 4, 2012 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, today announced the appointment of Liz Stewart as vice president, general counsel. In her role she will be responsible for overseeing all legal matters of Tela including intellectual property, licensing, commercial transactions and management of outside counsel.

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TSMC NEW STANDARD CELL SLIM LIBRARY REDUCES LOGIC AREA 15%

First Library Introduced Under AreaTrim Collaboration with Tela Innovations
Issued by: TSMC
Issued on: 2010/06/15

Hsinchu, Taiwan, R.O.C. – June 15, 2010 – Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today introduced the first Slim Library that reduces system-on-chip (SoC) routed logic block area by 15 percent compared to blocks routed through current standard cell libraries.

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Mellanox and TSMC Collaborate to Enable Next-Generation Green Data Centers

ConnectX(R)-2 InfiniBand and Ethernet Adapters, Utilizing TSMC’s PowerTrim Service, Deliver Optimized Power Efficiency to Substantially Reduce Data Center Power and Cooling Costs

SUNNYVALE, Calif. & YOKNEAM, Israel, Mar 23, 2010 (BUSINESS WIRE) — Mellanox(R) Technologies, Ltd. (NASDAQ:MLNX) (TASE:MLNX), a leading supplier of high-performance, end-to-end connectivity solutions for data center servers and storage systems, today announced that its ConnectX-2 family of adapters, recently released for general availability, leverages TSMC’s PowerTrim service to achieve best in class power performance of 4.5W for dual 10GbE ports. The technology is part of Mellanox’s energy-efficient data center initiative and delivers a 20 percent overall power leakage reduction in Mellanox’s current generation of adapter products. PowerTrim is a patented power optimization technology platform based on TSMC’s advanced manufacturing processes to reduce leakage in devices manufactured on TSMC 90nm and smaller process geometries.

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