Mellanox and TSMC Collaborate to Enable Next-Generation Green Data Centers

ConnectX(R)-2 InfiniBand and Ethernet Adapters, Utilizing TSMC’s PowerTrim Service, Deliver Optimized Power Efficiency to Substantially Reduce Data Center Power and Cooling Costs

SUNNYVALE, Calif. & YOKNEAM, Israel, Mar 23, 2010 (BUSINESS WIRE) — Mellanox(R) Technologies, Ltd. (NASDAQ:MLNX) (TASE:MLNX), a leading supplier of high-performance, end-to-end connectivity solutions for data center servers and storage systems, today announced that its ConnectX-2 family of adapters, recently released for general availability, leverages TSMC’s PowerTrim service to achieve best in class power performance of 4.5W for dual 10GbE ports. The technology is part of Mellanox’s energy-efficient data center initiative and delivers a 20 percent overall power leakage reduction in Mellanox’s current generation of adapter products. PowerTrim is a patented power optimization technology platform based on TSMC’s advanced manufacturing processes to reduce leakage in devices manufactured on TSMC 90nm and smaller process geometries.

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TSMC HELPS LSI REDUCE LEAKAGE 25 PERCENT ON NEXT GENERATION PRODUCT

PowerTrim gate length biasing optimizes power with no area or performance compromise

Hsinchu, Taiwan – January 6, 2010 – Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) (TWSE: 2330, NYSE: TSM) today announced that LSI Corporation achieved over 25% overall leakage reduction in a next-generation product by implementing TSMC’s PowerTrim power optimization technology on the company’s 65nm low power (LP) process.

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TELA INNOVATIONS SHOWCASES DESIGN AND PROCESS CO-OPTIMIZATION SOLUTIONS AT 2009 DAC

Expanded offering addresses power and area reduction through tight connection to TSMC manufacturing process

SAN JOSE, Calif. – July 13, 2009 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, will be demonstrating advancements in both its straight-line, one dimensional layout optimization technology and its CD biasing technology for reducing power at the 46th annual Design Automation Conference (DAC) July 26-30 in San Francisco. Both technologies work in conjunction with underlying manufacturing process technologies to optimize for critical area and power requirements. The company, which acquired the power optimization solution from Blaze Technology earlier this year, will demonstrate the results of its continued collaboration with TSMC in tightly coupling it design technology with the foundry’s advanced manufacturing processes.

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TELA INNOVATIONS ACQUIRES BLAZE DFM

Addition of proven power optimization technology strengthens offering to deliver maximum benefits from advanced semiconductor manufacturing processes

SAN JOSE, Calif. – February 23, 2009 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, today announced it has acquired Blaze DFM, a leading supplier of technology to reduce power in advanced manufacturing process nodes. The acquisition brings Blaze DFM’s complete line of products and technologies, including Blaze MO™ power-optimization technology, into the Tela portfolio. Key engineering personnel will join the company to enable continuity of product development and support of customers.

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TSMC and TELA INNOVATIONS ANNOUNCE STRATEGIC PARTNERSHIP TO ENHANCE DESIGN AND PROCESS CO-OPTIMIZATION

Companies to develop offerings using Tela’s pre-defined physical topologies and to enhance and support PowerTrim™ Service

SAN JOSE, Calif. – February 23, 2009 – Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) and Tela Innovations, today announced a strategic partnership to develop co-optimized design solutions using Tela’s innovative and patented lithography-optimized design technology and TSMC’s derivative processes. In addition, TSMC and Tela agreed to jointly support and enhance TSMC’s PowerTrim™ Service based on Blaze DFM’s patented gate CD biasing technology. Tela announced the acquisition of Blaze DFM today (see release).

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TELA INNOVATIONS CLOSES ADDITIONAL ROUND OF FINANCING, ADDS THREE NEW INVESTORS THAT SUPPORT UNIQUE APPROACH TO ADVANCED CHIP DESIGN

$5.5 million round also supported by current investors

SAN JOSE, Calif. – December 15, 2008 – Tela Innovations, an early-stage technology company developing a design solution to enable continued cost effective scaling of semiconductor manufacturing, today announced it has closed an additional round of financing, adding corporate investors Cadence Design Systems; KT Venture Group, LLC, the investment partner of KLA-Tencor Corporation; and Qualcomm Incorporated to its current set of investors, which includes Intel Capital. The round totaled $5.5 million and will be used to bring to market Tela’s unique approach of using on-grid, straight-line, one-dimensional layout structures to provide a more efficient and reliable way to design and manufacture next generation chips.

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TELA INNOVATIONS SHOWCASES INNOVATIVE ON-GRID, STRAIGHT-LINE APPROACH TO CHIP DESIGN AT INDUSTRY EVENTS

Presentations, demos at IITC and DAC show start-up’s approach to manufacturing challenges at 45nm and beyond

SAN JOSE, Calif. – May 29, 2008 – Tela Innovations, an early-stage technology company focused on addressing the challenges of scaling semiconductor manufacturing to 45nm and beyond, will showcase its innovative chip design technology at two upcoming industry events. The company will make presentations and demonstrate its technology at the Applied Materials Technical Symposium at IITC (International Interconnect Technology Conference) on June 2, 2008 in San Francisco, and the following week at the 2008 Design Automation Conference June 8-12 in Anaheim, California.

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TSMC ANNOUNCES POWER TRIM SERVICE FOR LEAKAGE POWER REDUCTION

Exclusively-licensed technology from Blaze DFM, Inc. enables design-specific leakage power reduction

Hsin-chu, Taiwan, R.O.C. – April 15, 2008 – Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today announced that it has signed an exclusive agreement with Blaze DFM, Inc. to offer Power Trim Service, a new service offering combining a patented Blaze power optimization technology with special variations of TSMC’s advanced manufacturing process.

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TELA INNOVATIONS UNVEILS STRATEGY, TECHNOLOGY FOR ADDRESSING MANUFACTURING AND LITHOGRAPHY CHALLENGES AT 45nm AND BEYOND

Innovative chip design technology uses on-grid, straight line patterns to extend Moore’s Law in efficient, predictable manner

SAN JOSE, Calif. – February 27, 2008 – Tela Innovations, an early-stage technology company focused on addressing the challenges of scaling semiconductor manufacturing to 45nm and beyond, today unveiled its business strategy and technology vision for using on-grid, straight-line, one-dimensional layout structures to provide a more efficient and reliable way to design and manufacture next generation chips. Details of the solution were disclosed at the SPIE Advanced Lithography Conference in joint presentations from Tela and ASML/Brion and Applied Materials.

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INTEL CAPITAL INVESTS IN TELA INNOVATIONS

Series B round to fund new approach to next-generation chip design

SAN JOSE, Calif. – February 27 2008 – Tela Innovations, an early stage technology company focused on addressing the challenges of scaling semiconductor manufacturing to 45nm and beyond, today announced that Intel Capital, the global investment arm of Intel Corporation, became a new investor in the company. Intel Capital’s investment was part of the company’s Series B round, which included new investor AsiaTech Management as well as existing investors.

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