Tuesday, April 9th
San Jose McEnery Convention Center
San Jose, CA
Booth 501

http://www.hwacomms.com/TSMC2013/NAtechsymposium/Attendee/index.html

“Tela has, and continues to, create technology to address critical technical and economic challenges facing the semiconductor industry. Our products enable designers to achieve the best performance, area and power characteristics possible as semiconductor processes continue to scale. Given the significance of our company’s investment in this technology and associated products, it was necessary to take legal action at this time,” said Scott Becker, president and CEO of Tela.

Tela’s complaint with the USITC seeks an exclusion order that would bar from entry into the United States infringing smartphones, tablets and other electronic devices that are imported by or on behalf of Respondents. Tela also seeks a cease and desist order to bar further sales of infringing products that have already been imported into the United States. Under its rules, the USITC has thirty days from the filing of the complaint to decide whether to formally institute an investigation.

Tela also filed parallel actions in the United States District Court for the District of Delaware alleging that Respondents’ same devices infringe the same patents identified in the USITC complaint. The Delaware complaints seek a permanent injunction and compensatory damages, as well as recovery of reasonable attorneys’ fees and costs. If the USITC institutes the investigation referenced above, Respondents will have a statutory right (but not the obligation) to stay the Delaware District Court proceeding pending a final determination in the USITC.

About Tela
Tela Innovations is a privately-held company based in Los Gatos, California that provides IC design solutions including cell libraries, design services and software products that address the challenge of scaling semiconductor design and manufacturing to advanced process nodes. Tela was founded in 2005 by a team of experts in semiconductor IP, design automation and process technology, and is backed by a number of venture firms and corporate investors. For more information on the company, visit www.tela-inc.com.

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All trademarks referred to are the property of their respective owners

LOS GATOS, Calif. – January 9, 2012 – Tela Innovations, which provides design solutions to enable continued cost-effective scaling of semiconductor manufacturing, has been ranked by IEEE Spectrum magazine as being among the leaders of the semiconductor and electronics industry for the quality and potential impact of its patents. In the 2012 edition of its prestigious Patent Power list, the publication ranks Tela 11^th in the Semiconductor Manufacturing category, placing the company alongside major suppliers such as Samsung (#1), SanDisk (#2), Broadcom (#4), Intel (#12) and Rambus (#13).

According to IEEE Spectrum, the rankings are “based on objective, quantitative benchmarking of the patent portfolios of more than 5,000 leading commercial enterprises, academic institutions, nonprofit organizations, and government agencies. This benchmarking…takes into account not only the size of organizations’ patent portfolios but also the quality, as reflected in characteristics such as growth, impact, originality, and general applicability.”

The full report can be seen here.

Tela received 31 new patents in 2011, bringing its total portfolio to more than 100. While relatively small in quantity in comparison to companies like Samsung and Intel, Tela was rewarded for the quality of its innovations, which are seen as having long-term impact on addressing key challenges in semiconductor manufacturing. Using a sophisticated scoring system, the report gave Tela an overall score of 833.4 to earn the 11^th place ranking in this category.

“This is a great honor and a testament to the innovation we are delivering to address critical technical and economic challenges facing the semiconductor industry. We are pleased to be recognized as having important technology that will enable designers to achieve the best performance, density and low power characteristics possible as semiconductor processes continue to scale,” said Scott Becker, president and CEO of Tela. “This report is also a strong statement about the importance of the patent process in general, which Tela uses to validate the value and uniqueness of our innovations.”

The majority of Tela’s patents focus on novel approaches engineers can use to optimize the size, performance and power of advanced IC designs. Its technology addresses issues brought on by advanced manufacturing processes that introduce new constraints and restrictions designers must overcome. Its solutions are aimed at extending the scaling of Moore’s Law for designs targeting 28nm and smaller geometries where lithography limitations drive more layout restrictions for both single pass and multiple patterning approaches.

About Tela
Tela Innovations is a privately-held company based in Los Gatos, California that provides solutions addressing the challenge of scaling semiconductor design and manufacturing to advanced process nodes. Tela was founded in 2005 by a team of experts in semiconductor IP, design automation and process technology, and is backed by a number of venture firms and corporate investors, including Intel Capital, Cadence Design Systems, KT Venture Group, LLC, the investment partner of KLA-Tencor Corporation, and Qualcomm Incorporated. For more information on the company visit www.tela-inc.com.

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All trademarks referred to are the property of their respective owners

Processors, memory, manufacturing processes, chip architecture, EDA, MEMS, RF, touch screens, servers and the Internet of Things are markets where startups can still make a difference.

What follows are ten rising companies worth tracking in 2013.

Tela Innovations

Tela Innovations Inc. (Los Gatos, Calif.) was founded in 2005 and started by working with Qualcomm on computational lithography with a view to the extraction of multi mask information for the double patterning era.

Tela’s technology is delivered as physical design representation applied to standard cell logic and embedded SRAM, analog and I/O that can result in area savings and reduced leakage current. The company offers gate-length trade-offs for power, performance and area within its libraries. Tela has also specialized in working with customers’ IP development teams to get the technology into production.

In February 2009 Tela acquired Blaze DFM, which added PowerTrim to its technology as well as a relationship with Taiwan Semiconductor Manufacturing Co. Ltd. which bore fruit in 2010.

The company has been fairly quiet since then but did say mid-2012 that it is ready with libraries for the 32/28-nm and 22/20-nm process nodes. The company’s investors provide reasons to watch the company. They include: Intel Capital, Cadence Design Systems Inc., KT Venture Group LLC (the investment partner of KLA-Tencor Corp.) and Qualcomm Inc. The fact that the company appointed an intellectual property legal counsel in 2012 is another reason to be watchful.

www.tela-inc.com

read full article here

Austin, TX
The Live Music Capital of the World becomes the Electronic Design Capital of the World

Conference dates: June 2-6, 2013
Exhibition dates: June 3-5, 2013
Booth 1815

http://www.dac.com/dac+2013.aspx

San Jose Convention Center, CA
150 West San Carlos St.
San Jose, CA 95110

Booth # 305

Register Now

Tela Innovations has released its new standard cell libraries optimized for 32/28nm and 22/20nm manufacturing processes. The foundry-independent libraries leverage the company’s proactive approach to the design challenges posed by lithography constraints at 28nm and below, stated the company.

The Tela approach embraces the inherent lithography constraints and results in designs with simpler, more manufacturable shapes. From a designer’s perspective, Tela’s approach to layout is transparent, as the libraries contain a complete set of functions that provide the ability to implement optimized designs based on all of their specific performance, power and area (PPA) requirements. In addition, the Tela libraries go further and introduce cell options for routability tradeoffs providing additional design flexibility, the company revealed.

The 32/28nm libraries are available in architectures optimized for density or speed, and support poly-silicon gate as well as high-K metal gate, gate first and gate last, processes. They come with a complete set of logic and storage elements with multiple circuit variants, including drive strengths and parametric tradeoffs, as well as specialized cells to implement arithmetic and register file functions. The libraries support traditional back-end, physical EDA views including GDSII, schematics and circuit simulation.

The libraries are capable of supporting Tela’s gate length biasing technology while maintaining maximum layout pattern uniformity. Gate length biasing techniques provide a significantly better leakage vs. speed tradeoff option for designers compared to multiVt techniques, added the company.

For 22/20nm libraries, the absence of a new generation of lithography such as EUV introduces new challenges. Printing 20nm features with 193nm light requires new design approaches encompassing not only Restricted Design Rules (RDR) but double patterning compatible layout as well. The introduction of double patterning for metal layers and local interconnects creates additional complexities for chip designers. Tela’s layout in its 22/20nm library ensures the cleanest pattern splitting, resulting in highly manufacturable patterns on the masks, the company indicated. These libraries also incorporate innovative circuit and layout design techniques to maximize the benefit of new process features such as local interconnect.

These new libraries are available from Tela. Due to the more simplified architecture of these libraries, they can also be quickly customized to specific customer requirements.

http://www.ednasia.com/ARTP_8800505878_1000005.HTM