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Tela Innovations offers a next-generation solution for designing advanced semiconductors in the ‘sub wavelength,’ low k 1 era – 45nm and beyond. The Tela solution uses on-grid, straight line, one dimensional layout structures to produce a lithography-optimized layout. The result of using Tela’s pre-defined, predictable topologies is significant improvements in variability, performance, leakage and area.

 

March 4, 2008
Startup Accepts Challenge Of Sub-45-nm Lithography
Electronic Design

February 28, 2008
SPIE: Tela Innovations lays it all out straight
SOLID STATE TECHNOLOGY
By M. David Levenson, Editor-in-Chief, Microlithography World

February 28, 2008
Gridded topology eases IC design and manufacturing
SCDsource
By Richard Goering

February 27, 2008
Intel joins funding for startup Tela
SAN JOSE BUSINESS JOURNAL

“Tela’s approach looks promising in its ability to provide a structured design style while meeting our design objectives. The evaluation results we are seeing for advanced process technologies are impressive.”
 
— Nick Yu,
VP of Engineering, Qualcomm.

Feb 24-29, 2008
SPIE Advanced Lithography Conference

March 31- April 3
GlobalPress Electronics Summit

June 8- 13, 2008
Design Automation Conference