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TECHNICAL PAPERS

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  • 16nm with 193nm Immersion Lithography and Double Exposure
    SPIE 2010
     
  • 22nm Logic Lithography in the Presence of Local Interconnect
    SPIE 2010
     
  • Joint-Optimization for SRAM and Logic for 28nm node and below
    SPIE 2010
     
  • Inter-layer Self-Aligning Process for 22nm Logic
    SPIE 2010
     
  • 32nm and below Logic Patterning using Optimized Illumination and Double Patterning
    SPIE Advanced Lithography Conference — February 2009
     
  • Gridded Design: Rules - 1-D Approach Enables Scaling of CMOS Logic
    Nanochip Technology Journal — Issue Two 2008
     
  • Design Automation Conference Presentation
    DAC - June 2008
     
  • APF® Pitch-Halving for 22nm Logic Cells using Gridded Design Rules
    SPIE Advanced Lithography -— February 2008
     
  • Low k1 Logic Design using Gridded Design Rules
    SPIE Advanced Lithography — February 2008
     
  • DFM – It’s all about Flexibility
    EDP Conference — April 2007